The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Jul. 03, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Sawyer I. Cohen, Sunnyvale, CA (US);

David A. Pakula, San Francisco, CA (US);

Tseng-Mau Yang, Mississaugua, CA;

Tyler B. Cater, Cupertino, CA (US);

Ashutosh Y. Shukla, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 21/02 (2006.01); G06F 1/20 (2006.01); F28F 21/06 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); F28F 21/02 (2013.01); F28F 21/067 (2013.01); G06F 1/20 (2013.01); H05K 7/20481 (2013.01);
Abstract

This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.


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