The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Aug. 15, 2013
Applicants:

Nanchang O-film Tech Co., Ltd., Nanchang, CN;

Suzhou O-film Tech Co., Ltd., SUZHOU, CN;

Shenzhen O-film Tech Co., Ltd., Shenzhen, CN;

Inventors:

Sheng Zhang, Shenzhen, CN;

Ying Gu, Shenzhen, CN;

Shengbo Guo, Shenzhen, CN;

Peiting Ma, Shenzhen, CN;

Yunliang Yang, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/77 (2011.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 3/107 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0376 (2013.01);
Abstract

A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with the base layer, and thus the probability of damage under a stress is reduced. Designed to be a grid-like structure, the conductive traces become more transparent, while satisfying a function of a connector. Besides, the above flexible circuit connecting device has a high density circuit trace, so that the size of the connector can be reduced and the interior space of the electronic components can be saved. In a manufacture process of the above flexible circuit connecting device, the manufacture process can be simplified, manufacture efficiency and production yield can be improved, and manufacture cost can be efficiently reduced.


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