The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Jul. 17, 2014
Applicant:

Nissha Printing Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Seiichi Yamazaki, Kyoto, JP;

Toshihiro Higashikawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/00 (2006.01); H01R 4/04 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
H01R 4/04 (2013.01); B29C 45/14016 (2013.01); B29C 45/14065 (2013.01); B29C 45/14639 (2013.01); B29C 2045/14147 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3437 (2013.01);
Abstract

A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.


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