The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Jun. 28, 2012
Applicants:

Ayako Yoshida, Kawasaki, JP;

Shinichi Ishizuka, Kawasaki, JP;

Takuo Shinohara, Kawasaki, JP;

Inventors:

Ayako Yoshida, Kawasaki, JP;

Shinichi Ishizuka, Kawasaki, JP;

Takuo Shinohara, Kawasaki, JP;

Assignee:

PIONEER CORPORATION, Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/52 (2006.01); H05B 33/02 (2006.01); H05B 33/04 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 27/3276 (2013.01); H01L 27/3288 (2013.01); H05B 33/02 (2013.01); H05B 33/04 (2013.01); H01L 23/5256 (2013.01); H01L 2251/5392 (2013.01); H01L 2924/0002 (2013.01);
Abstract

[Problem] Provided is an organic EL panel in which on a support supporting at least one organic EL element, a connecting wire for supply of power to the organic EL is disposed, and which is capable of preventing damage of the support by heat and impact caused by melting disconnection of a fuse part that is provided in the connecting wire. [Solution Means] A buffer layer is disposed between a face supporting the connecting wire on the support and the fuse part.


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