The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

May. 10, 2013
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Yuhsuke Fujita, Osaka, JP;

Kenichi Akamatsu, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/02 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H05K 1/0203 (2013.01); H05K 1/0271 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/3025 (2013.01); H05K 1/09 (2013.01); H05K 1/189 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2009 (2013.01);
Abstract

The folding along the disposed direction of wiring patterns is prevented. Concave-convex shapes in a plan view for preventing the folding of a device as step portions in a plan view are provided on opposing sides of two conductive regions. A front edge sideof a convex shape in a plan view of a Cu foil layer, which is one of the two conductive regions, is disposed to enter into a concave portion (on the side of a bottom side) of a concave shape in a plan view of a Cu foil layer, which is the other conductive region, to prevent the folding along the disposed direction of wiring patterns.


Find Patent Forward Citations

Fujita, Yuhsuke. (2016). Film wiring substrate and light emitting device (U.S. Patent No. 9444021). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9444021

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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