The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Mar. 01, 2011
Koji Asakawa, Kanagawa-ken, JP;
Akira Fujimoto, Kanagawa-ken, JP;
Ryota Kitagawa, Tokyo, JP;
Takanobu Kamakura, Kanagawa-ken, JP;
Shinji Nunotani, Tokyo, JP;
Eishi Tsutsumi, Kanagawa-ken, JP;
Masaaki Ogawa, Kanagawa-ken, JP;
Koji Asakawa, Kanagawa-ken, JP;
Akira Fujimoto, Kanagawa-ken, JP;
Ryota Kitagawa, Tokyo, JP;
Takanobu Kamakura, Kanagawa-ken, JP;
Shinji Nunotani, Tokyo, JP;
Eishi Tsutsumi, Kanagawa-ken, JP;
Masaaki Ogawa, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor light emitting device includes a structural body, a first electrode layer, and a second electrode layer. The structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first and second semiconductor layers. The first electrode layer includes a metal portion, plural first opening portions, and at least one second opening portion. The metal portion has a thickness of not less than 10 nanometers and not more than 200 nanometers along a direction from the first semiconductor layer toward the second semiconductor layer. The plural first opening portions each have a circle equivalent diameter of not less than 10 nanometers and not more than 1 micrometer. The at least one second opening portion has a circle equivalent diameter of more than 1 micrometer and not more than 30 micrometers.