The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Jan. 30, 2012
Applicants:

Michael John Bergmann, Chapel Hill, NC (US);

Christopher D. Williams, Morrisville, NC (US);

Kevin Shawne Schneider, Cary, NC (US);

Kevin Haberern, Cary, NC (US);

Matthew Donofrio, Raleigh, NC (US);

Inventors:

Michael John Bergmann, Chapel Hill, NC (US);

Christopher D. Williams, Morrisville, NC (US);

Kevin Shawne Schneider, Cary, NC (US);

Kevin Haberern, Cary, NC (US);

Matthew Donofrio, Raleigh, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/40 (2013.01); H01L 24/32 (2013.01); H01L 33/62 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29084 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/4814 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A light emitting diode structure includes a diode region and a metal stack on the diode region. The metal stack includes a barrier layer on the diode region and a bonding layer on the barrier layer. The barrier layer is between the bonding layer and the diode region. The bonding layer includes gold, tin and nickel. A weight percentage of tin in the bonding layer is greater than 20 percent and a weight percentage of gold in the bonding layer is less than about 75 percent. A weight percentage of nickel in the bonding layer may be greater than 10 percent.


Find Patent Forward Citations

Loading…