The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Sep. 25, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Inventors:

Zhenfei Cai, Beijing, CN;

Zhaohui Hao, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); H01L 23/60 (2013.01); H01L 27/1259 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There is disclosed a method for manufacturing an Electro Static Discharge (ESD) device, an ESD device and a display panel, which are capable of addressing an issue that static-electric charges accumulated on the array substrate damage the unformed ESD device and improving a yield ratio of the array substrate. The method includes forming a TFT, a first lead wire, wherein the first lead wire or the second lead wire comprises at least two separate lead-wire segments; depositing a layer of passivation thin film, and forming via-holes for connecting the at least two separate lead-wire segments on the layer of passivation thin film; depositing a layer of transparent conductive film on the substrate on which the via-holes are formed, wherein the layer of transparent conductive film connects the lead-wire segments by the via-holes.


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