The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 27, 2013
Applicant:

Enpirion, Inc., Hampton, NJ (US);

Inventors:

Ashraf W. Lotfi, Bridgewater, NJ (US);

Jeffrey Demski, Orefield, PA (US);

Anatoly Feygenson, Hillsborough, NJ (US);

Douglas Dean Lopata, Boyertown, PA (US);

Jay Norton, Wind Gap, PA (US);

John D. Weld, Ledgewood, NJ (US);

Assignee:

Enpirion, Inc., Hampton, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 21/8238 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01); H01L 23/482 (2006.01); H01L 23/36 (2006.01); H01L 23/495 (2006.01); H01L 29/78 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 21/8234 (2013.01); H01L 21/823871 (2013.01); H01L 23/36 (2013.01); H01L 23/4824 (2013.01); H01L 23/495 (2013.01); H01L 23/49589 (2013.01); H01L 23/522 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 27/0203 (2013.01); H01L 27/0688 (2013.01); H01L 27/088 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 29/41758 (2013.01); H01L 29/665 (2013.01); H01L 29/66659 (2013.01); H01L 29/7835 (2013.01); H01L 21/28518 (2013.01); H01L 21/76801 (2013.01); H01L 21/76895 (2013.01); H01L 23/3107 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 29/0847 (2013.01); H01L 29/1045 (2013.01); H01L 29/1083 (2013.01); H01L 29/456 (2013.01); H01L 29/4933 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor ('LDMOS') cells, and a metallic layer electrically coupled to the plurality of LDMOS cells. The semiconductor device also includes a plurality of gate drivers positioned along a periphery of the semiconductor die and electrically coupled to gates of the plurality of LDMOS cells through the metallic layer.


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