The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Sep. 02, 2013
Applicants:

Noritake Co., Limited, Aichi, JP;

Noritake Itron Corporation, Mie, JP;

Inventors:

Tadami Maeda, Mie, JP;

Naoki Noda, Mie, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/3025 (2013.01); H05K 1/11 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Provided is a substrate for mounting an LED element in which a stable light-emitting surface is obtained, as well as a light source and an LED display using this substrate, so that the axis at which light is emitted by a chip LED does not vary. The substrate for mounting an LED element () comprises a substrate () on which an LED element can be mounted, and a wiring layer () for supplying electricity to an LED element (). The wiring layer () for supplying electricity to the LED element () is formed on a mirror-finished surface on the entirety of a substrate surface on which the LED element is mounted, except for an insulating spacecapable of providing insulation between terminals of the LED element.


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