The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Jun. 09, 2015
Apple Inc., Cupertino, CA (US);
Corey N. Axelowitz, San Francisco, CA (US);
Eric C. Lee, Mountain View, CA (US);
Shawn Xavier Arnold, San Jose, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
Electrical components such as semiconductor die may be mounted in semiconductor packages and embedded within printed circuits. A printed circuit may have a substrate with an opening and may have metal layers. During lamination operations, substrate material such as prepreg may flow and form embedding dielectric material that embeds the semiconductor die within the opening. Double-sided semiconductor dies may be formed by attaching multiple semiconductor dies together using a layer of material such as die attach film. The double-sided semiconductor dies may be embedded within a printed circuit and mounted in semiconductor packages. Wire bond wires may be used to couple one of the semiconductor dies in a double-sided semiconductor die to contacts on a substrate. Wire bond wires may also be used to couple a shield layer to the substrate.