The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Feb. 09, 2016
Applicant:

Sfi Electronics Technology Inc., Taoyuan, TW;

Inventors:

Ching-Hohn Lien, Taoyuan, TW;

Xing-Xiang Huang, Taoyuan, TW;

Hsing-Tsai Huang, Taoyuan, TW;

Jie-An Zhu, Shanghai, CN;

Hong-Zong Xu, Taoyuan, TW;

Yi-Wei Chen, Taoyuan, TW;

Jung-Chun Chiang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2225/06551 (2013.01);
Abstract

A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.


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