The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Feb. 13, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Gerard Anthony C. Afable, Singapore, SG;

Howell John Chua Toc, Singapore, SG;

Prakash Venkatesappa, Singapore, SG;

Kok Peng Teo, Singapore, SG;

Annabelle Q. Yang, Singapore, SG;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 27/14618 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/81206 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/95 (2013.01); H01L 2924/15153 (2013.01); Y10T 29/49826 (2015.01); Y10T 29/49998 (2015.01);
Abstract

A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.


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