The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Jul. 11, 2014
Applicant:
Synaptics Display Devices Gk, Tokyo, JP;
Inventors:
Assignee:
SYNAPTICS DISPLAY DEVICES GK, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/82 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/82 (2013.01); H01L 22/34 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 29/0607 (2013.01); H01L 23/3114 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor wafer includes circuit integration regions each incorporating an integrated circuit and guard rings disposed to surround the circuit integration regions, respectively. A scribe region disposed between every adjacent two of the guard rings. An element and a pad electrically connected to the element are disposed in the scribe region. A groove is disposed along a corresponding guard ring on a front surface of the semiconductor wafer between the pad and the corresponding guard ring. The distance between the groove and the pad is varied along the corresponding guard ring.