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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9443784 B1

PDFFull Text
Expired
Date of Patent:
Sep. 13, 2016

Filed:

Mar. 09, 2012

Semiconductor module including plate-shaped insulating members having different thickness

Applicant:

Kenji Hatori, Tokyo, JP;

Inventor:

Kenji Hatori, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Matthew Gordon

Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/49833 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15159 (2013.01);
Abstract

A power semiconductor chip and a low-power portion that has power consumption lower than that of the power semiconductor chip are located on a predetermined surface side of a heat sink having conductivity. A first plate-shaped insulating member extends between the power semiconductor chip and the heat sink. A second plate-shaped insulating member extends between the low-power portion and the heat sink. A portion, which faces the low-power portion, of the second plate-shaped insulating member is thicker than a portion, which faces the power semiconductor chip, of the first plate-shaped insulating member.

Find Patent Forward Citations

Hatori, Kenji. (2016). Semiconductor module including plate-shaped insulating members having different thickness (U.S. Patent No. 9443784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9443784

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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