The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Oct. 30, 2014
Applicant:

Marvell World Trade Ltd., St. Michael, BB;

Inventors:

Patrick A. McKinley, Corvallis, OR (US);

Walter Lee McNall, Meridian, ID (US);

Robert W. Shreeve, Corvallis, OR (US);

Thomas Page Bruch, Corvallis, OR (US);

Neal C. Jaarsma, Corvallis, OR (US);

Assignee:

Marvell World Trade Ltd., St. Michael, BB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/768 (2006.01); H03K 19/177 (2006.01); G06F 21/73 (2013.01); H01L 23/00 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); G06F 21/73 (2013.01); H01L 21/265 (2013.01); H01L 21/76892 (2013.01); H01L 23/576 (2013.01); H03K 19/17768 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure describes apparatuses and techniques for device-based die authentication. In some aspects, an intensity of a particle beam is varied during semiconductor processing to provide a semiconductor die having devices of varied values. In other aspects, different areas of semiconductor dies are exposed during semiconductor processing to provide semiconductor dies with devices that vary in value from one die to the next. For each semiconductor die, a value generated based on the values of the die's respective devices can be associated with that die thereby enabling subsequent authentication of the semiconductor die.


Find Patent Forward Citations

Loading…