The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 18, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuhiro Yamauchi, Suntou-gun, JP;

Satoru Nishioka, Suntou-gun, JP;

Kenichi Yamauchi, Mishima, JP;

Hiroki Masu, Tokyo, JP;

Noriko Suzumura, Mishima, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01); G03G 15/02 (2006.01); G03G 15/08 (2006.01); G03G 15/16 (2006.01); G03G 5/147 (2006.01); G03G 15/22 (2006.01);
U.S. Cl.
CPC ...
G03G 15/75 (2013.01); G03G 5/14704 (2013.01); G03G 5/14708 (2013.01); G03G 15/0233 (2013.01); G03G 15/0818 (2013.01); G03G 15/1685 (2013.01); G03G 15/22 (2013.01); G03G 2221/1606 (2013.01);
Abstract

Provided is an electroconductive member for electrophotography which is suppressed in adhesion of a contaminant to a surface thereof. The electroconductive member for electrophotography includes, in this order, an electroconductive support, an electroconductive elastic layer, and a surface layer. The surface layer contains a binder resin and electroconductive fine particles having a number average particle diameter of 5.0 nm or more and 50.0 nm or less. At least part of the electroconductive fine particles are exposed from the surface layer. The surface layer has, on a surface thereof, protruded portions derived from exposed portions of the electroconductive fine particles. The surface layer has a volume resistivity of 1.0×10Ωcm or more and 1.0×10Ωcm or less and a universal hardness at a depth of 1 μm from the surface thereof of 1.0 N/mmor more and 7.0 N/mmor less.


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