The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Dec. 21, 2015
Applicants:

Toshihiko Mouri, Aichi, JP;

Noriyoshi Yoshizuka, Aichi, JP;

Yousuke Sugai, Aichi, JP;

Fuminori Satoji, Aichi, JP;

Inventors:

Toshihiko Mouri, Aichi, JP;

Noriyoshi Yoshizuka, Aichi, JP;

Yousuke Sugai, Aichi, JP;

Fuminori Satoji, Aichi, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 33/06 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01); B22F 5/10 (2006.01); B22F 7/06 (2006.01); F16C 17/02 (2006.01); C22C 33/02 (2006.01); F16C 33/10 (2006.01); B22F 3/03 (2006.01);
U.S. Cl.
CPC ...
F16C 33/128 (2013.01); B22F 5/106 (2013.01); B22F 7/06 (2013.01); C22C 33/0278 (2013.01); F16C 17/02 (2013.01); F16C 33/125 (2013.01); F16C 33/145 (2013.01); B22F 2003/033 (2013.01); B22F 2207/01 (2013.01); B22F 2998/10 (2013.01); F16C 33/10 (2013.01); F16C 2202/06 (2013.01); F16C 2204/60 (2013.01);
Abstract

Provided is a sintered bearing () including an inner layer () and an outer layer () formed by integral molding, the sintered bearing () having a bearing surface (A) formed on an inner peripheral surface () of an inner layer (). The inner layer () is made of sintered metal containing Fe and a hardness increasing element (such as Ni or Mo). The outer layer () is made of sintered metal containing Fe and no hardness increasing element. A concentration gradient of the hardness increasing element is present at an interface between the inner layer () and the outer layer ().


Find Patent Forward Citations

Loading…