The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Aug. 22, 2014
Denso Corporation, Kariya, Aichi-pref., JP;
Hiroshi Tagawa, Nagoya, JP;
Akiyuki Sudou, Takahama, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A sensor assembly includes a sensor chip, a circuit board, and a wire holding case. The wire holding case holds a bonding wire, which connects the sensor chip with the circuit board. The wire holding case is inserted in an insertion hole of a case. The wire holding case has a low rigidity portion and a high rigidity portion in an X direction. The low rigidity portion has a space accommodating the bonding wire. The high rigidity portion has a reference surface in contact with an inner periphery of the insertion hole to position the wire holding case in a Y direction. The high rigidity portion has a surface on the opposite side of the reference surface in the Y direction. The surface is biased from a projection, which is formed on the inner periphery of the insertion hole, in the Y direction.