The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Oct. 24, 2014
Applicant:
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Inventor:
Tomohiko Kitamura, Ichihara, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C10M 133/44 (2006.01); H01L 21/321 (2006.01); C10M 133/22 (2006.01); B23D 61/18 (2006.01); C09K 3/14 (2006.01); B28D 5/00 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); C10M 173/02 (2006.01); C10M 133/38 (2006.01); C10M 133/42 (2006.01); C10M 133/46 (2006.01);
U.S. Cl.
CPC ...
C10M 133/44 (2013.01); B23D 61/185 (2013.01); B28D 5/0076 (2013.01); C09K 3/1409 (2013.01); C10M 133/22 (2013.01); C10M 133/38 (2013.01); C10M 133/42 (2013.01); C10M 133/46 (2013.01); C10M 173/02 (2013.01); H01L 21/02024 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); C10M 2207/022 (2013.01); C10M 2215/222 (2013.01); C10M 2215/223 (2013.01); C10M 2215/224 (2013.01); C10N 2230/06 (2013.01); C10N 2240/00 (2013.01);
Abstract
A silicon-wafer processing fluid used for processing a silicon wafer contains a friction modifier containing a nitrogen-containing compound, pH of the nitrogen-containing compound being in a range from 2 to 8 when a mass ratio with water (i.e. nitrogen-containing compound/water) is 1/99. The nitrogen-containing compound is preferably a heterocyclic compound. The silicon-wafer processing fluid restrains an abrasion of abrasive grains rigidly attached to a wire and generation of hydrogen.