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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9441069 B1

PDFFull Text
Date of Patent:
Sep. 13, 2016

Filed:

Mar. 19, 2013

Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Kazuo Arita, Ichihara, JP;

Hajime Watanabe, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08G 59/22 (2006.01); C08L 63/00 (2006.01); C08G 59/14 (2006.01); C08G 59/24 (2006.01); H05K 1/03 (2006.01); C08J 7/04 (2006.01); H05K 1/02 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); H05K 3/46 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C08G 59/22 (2013.01); C08G 59/1494 (2013.01); C08G 59/245 (2013.01); C08J 5/24 (2013.01); C08J 7/047 (2013.01); C08K 3/22 (2013.01); C08L 63/00 (2013.01); H05K 1/0209 (2013.01); H05K 1/0326 (2013.01); C08J 2363/00 (2013.01); C08K 7/18 (2013.01); C08K 2003/2227 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/31529 (2015.04);
Abstract

The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

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