The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Apr. 01, 2013
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Kenneth Edward Salsman, Pleasanton, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 1/00 (2006.01); B81B 3/00 (2006.01); G06F 3/03 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); H04N 5/33 (2006.01); H04N 9/04 (2006.01); G01J 3/02 (2006.01); G01J 3/28 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0029 (2013.01); G06F 3/0304 (2013.01); H01L 27/14629 (2013.01); H04N 5/2258 (2013.01); H04N 5/332 (2013.01); H04N 9/045 (2013.01); B81B 2201/032 (2013.01); G01J 3/0229 (2013.01); G01J 3/2823 (2013.01);
Abstract

Imaging systems may include an image sensor and a microelectromechanical systems array. The microelectromechanical systems array may be mounted over the image sensor. The system may include an infrared lens that focuses infrared light onto a first surface of the microelectromechanical systems array and a visible light source that illuminates an opposing second surface of the microelectromechanical systems array. The image sensor may capture images of the opposing second surface of the microelectromechanical systems array. The system may include processing circuitry that generates infrared images of a scene using the captured images of the microelectromechanical systems array. Microelectromechanical systems elements in the microelectromechanical systems array may change position or shape in response to infrared light that is absorbed by the microelectromechanical systems elements. Each microelectromechanical systems element may include infrared absorbing material on a metal layer. The system may include optical elements that focus visible light onto the image sensor.


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