The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

May. 05, 2014
Applicants:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Inventors:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Assignee:

Picosys Inc, Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); B32B 43/00 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/00 (2013.01); B32B 38/0008 (2013.01); B32B 43/006 (2013.01); B32B 38/0036 (2013.01); B32B 2310/00 (2013.01); B32B 2439/80 (2013.01); B32B 2535/00 (2013.01); Y10T 156/1195 (2015.01); Y10T 156/1972 (2015.01);
Abstract

Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.


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