The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 08, 2013
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Nobuo Saitou, Saitama, JP;

Jun Kaneki, Okayama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/00 (2006.01); C09J 7/02 (2006.01); G11B 5/64 (2006.01); B29C 45/14 (2006.01); B29L 31/28 (2006.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14811 (2013.01); B29C 45/1418 (2013.01); B29C 45/14688 (2013.01); B29C 2045/14245 (2013.01); B29K 2633/08 (2013.01); B29K 2995/0087 (2013.01); B29L 2031/286 (2013.01); B29L 2031/3041 (2013.01); B29L 2031/724 (2013.01); B29L 2031/778 (2013.01); Y10T 428/24851 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/266 (2015.01); Y10T 428/31855 (2015.04); Y10T 428/31909 (2015.04);
Abstract

A decorative sheet for insert molding prepared by laminating at least a surface protective layer on a support that includes an ABS resin, wherein the support has a flexural modulus of 1500 to 3000 MPa, and a thickness of 100 to 500 μm; the surface protective layer is obtained by cross-linking and curing an ionizing radiation curable resin composition; and the ionizing radiation curable resin composition has a tensile modulus of more than 100 MPa to less than 1000 MPa and a static frictional coefficient of 1.0 or less on a surface. The decorative sheet for insert molding includes at least a picture layer, a low glossy picture ink layer provided partially and the surface protective layer in this order on the support. The surface protective layer has a thickness of 1 to 30 μm.


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