The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

May. 29, 2013
Applicants:

Alexander Ovtchinnikov, Worcester, MA (US);

Igor Berishev, Holden, MA (US);

Alexey Komissarov, Charlton, MA (US);

Svletan Todorov, Oxford, MA (US);

Pavel Trubenko, Northboro, MA (US);

Inventors:

Alexander Ovtchinnikov, Worcester, MA (US);

Igor Berishev, Holden, MA (US);

Alexey Komissarov, Charlton, MA (US);

Svletan Todorov, Oxford, MA (US);

Pavel Trubenko, Northboro, MA (US);

Assignee:

IPG PHOTONICS CORPORATION, Oxford, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); H05K 3/00 (2006.01); H01L 23/00 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
B23K 26/367 (2013.01); B23K 26/0622 (2015.10); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 2203/172 (2015.10); H01L 24/83 (2013.01); H01L 2224/291 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/12042 (2013.01); H01S 5/02236 (2013.01); H01S 5/02272 (2013.01); H05K 3/0026 (2013.01); H05K 3/0052 (2013.01); Y10T 29/53174 (2015.01);
Abstract

A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.


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