The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Dec. 25, 2012
Applicant:

Yokota Technica Limited Company, Tokyo, JP;

Inventor:

Yatsuharu Yokota, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); B23K 3/04 (2006.01); B23K 1/008 (2006.01); B23K 1/00 (2006.01); B23K 1/012 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 3/04 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 3/087 (2013.01); B23K 2201/42 (2013.01); H05K 3/3494 (2013.01);
Abstract

A reflow furnace () has a decompression chamber (), and air bubbles contained in a molten solder on a substrate () are removed in this decompression chamber (). The substrate () supported on a first conveying rail () is fed into the decompression chamber () by a first conveyance rod (). The substrate () in the decompression chamber () is taken out by a second conveyance rod () and is conveyed to the exit of the reflow furnace () while being supported on the second conveying rail (). Before the treatment of substrates () having different widths, the width of the first conveying rail () and the width of the second conveying rail () are adjusted. During this adjustment, the second conveyance rod () is displaced in the width direction of the substrate (), with the second conveyance rod () kept in the decompression chamber (), and in association with this, the spacing between right and left rail portions () in the decompression chamber () is adjusted.


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Yokota, Yatsuharu. (2016). Heat processing device (U.S. Patent No. 9440303). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9440303

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