The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Aug. 09, 2012
Eiichi Ide, Tokyo, JP;
Eiji Nishioka, Tokyo, JP;
Toshiaki Ishii, Tokyo, JP;
Junpei Kusukawa, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Tokihito Suwa, Hitachinaka, JP;
Eiichi Ide, Tokyo, JP;
Eiji Nishioka, Tokyo, JP;
Toshiaki Ishii, Tokyo, JP;
Junpei Kusukawa, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Tokihito Suwa, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.