The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Mar. 19, 2015
Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Minoru Onodera, Saijo, JP;

Shuji Matsunaga, Saijo, JP;

Tatsuya Sunamoto, Saijo, JP;

Shigeaki Suzuki, Tokyo, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01); C09K 19/20 (2006.01); C09K 19/30 (2006.01); C09K 19/32 (2006.01); C09K 19/38 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); C09K 19/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4602 (2013.01); C09K 19/2014 (2013.01); C09K 19/3087 (2013.01); C09K 19/322 (2013.01); C09K 19/3809 (2013.01); H05K 1/0237 (2013.01); H05K 1/0313 (2013.01); H05K 3/281 (2013.01); H05K 3/4611 (2013.01); H05K 3/4635 (2013.01); H05K 3/4688 (2013.01); H05K 3/4691 (2013.01); C09K 2019/122 (2013.01); C09K 2219/03 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/2063 (2013.01); H05K 2203/06 (2013.01); H05K 2203/12 (2013.01);
Abstract

A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.


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