The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Nov. 26, 2013
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Shuichi Takizawa, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/3442 (2013.01); H05K 3/3452 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09118 (2013.01); Y02P 70/611 (2015.11);
Abstract
An electronic module is provided with a circuit board, a chip componentsurface-mounted on the circuit boardand a mold memberthat seals the chip component. The circuit boardincludes a landand a resist patternA that partially covers the land. The chip componenthas a bottom electrodeand a side electrode. The resist patternA has an overlapped portion overlapped with the bottom electrodeof the chip componentin a planar view. A portion of the mold memberis filled at least in a first gap Dbetween the resist patternA and the first solder portion