The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Jun. 27, 2014
Applicants:

Jeffrey K. Jones, Chandler, AZ (US);

Basim H. Noori, Gilbert, AZ (US);

Michael E. Watts, Scottsdale, AZ (US);

Inventors:

Jeffrey K. Jones, Chandler, AZ (US);

Basim H. Noori, Gilbert, AZ (US);

Michael E. Watts, Scottsdale, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 29/86 (2006.01); H01L 29/06 (2006.01); H03F 3/21 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H03F 1/56 (2006.01); H01L 23/047 (2006.01); H03F 3/195 (2006.01); H03F 3/193 (2006.01);
U.S. Cl.
CPC ...
H03F 3/21 (2013.01); H01L 23/047 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H03F 1/565 (2013.01); H03F 3/193 (2013.01); H03F 3/195 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/13091 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

An embodiment of an integrated passive device (IPD) assembly includes a first capacitor formed over a semiconductor substrate, where the first capacitor includes a first capacitor electrode, a second capacitor electrode, and dielectric material that electrically insulates the first capacitor electrode from the second capacitor electrode. The IPD assembly also includes a first contact pad exposed at a top surface of the IPD assembly and electrically coupled to the second capacitor electrode, and a second contact pad exposed at the top surface of the IPD. A second capacitor is coupled to the top surface of the IPD, and includes a first terminal electrically coupled to the first contact pad, and a second terminal electrically coupled to the second contact pad. The IPD assembly may be included in a packaged RF device, forming portions of an output impedance matching circuit and an envelope frequency termination circuit.


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