The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Apr. 25, 2013
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Hideaki Takasaki, Handa, JP;
Takashi Kataigi, Handa, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68721 (2013.01); H01L 21/68785 (2013.01);
Abstract
A member for a semiconductor manufacturing apparatus includes an electrostatic chuck, a cooling unit, a spacer (an O-ring, an outer periphery spacer, or the like) for securing a gap placed between the electrostatic chuck and the cooling unit, and a clamp ring placed on the upper surface of the outer periphery of the electrostatic chuck. The clamp ring is fastened to the cooling unit with screws. The screws are inserted into coil springs that prevent loosening, and are fastened to nuts. The coil springs are attached not to the clamp ring side but to the cooling unit side.