The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Apr. 20, 2015
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Yunpeng Song, Fremont, CA (US);

Yongsheng Liu, San Jose, CA (US);

Hongyu Deng, Saratoga, CA (US);

Assignee:

FINISAR CORPORATION, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/04 (2006.01); H01P 3/00 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01P 5/08 (2006.01);
U.S. Cl.
CPC ...
H01P 5/08 (2013.01); H01P 1/047 (2013.01); H01P 3/003 (2013.01); H01P 3/08 (2013.01); H05K 1/0243 (2013.01); H05K 1/112 (2013.01); H05K 1/0227 (2013.01); H05K 1/0251 (2013.01); H05K 2201/09236 (2013.01);
Abstract

In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.


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