The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Aug. 10, 2009
Applicants:

Michael John Bergmann, Chapel Hill, NC (US);

Kevin Ward Haberern, Cary, NC (US);

Bradley E. Williams, Cary, NC (US);

Winston T. Parker, Cary, NC (US);

Arthur Fong-yuen Pun, Raleigh, NC (US);

Doowon Suh, Cary, NC (US);

Matthew Donofrio, Raleigh, NC (US);

Inventors:

Michael John Bergmann, Chapel Hill, NC (US);

Kevin Ward Haberern, Cary, NC (US);

Bradley E. Williams, Cary, NC (US);

Winston T. Parker, Cary, NC (US);

Arthur Fong-Yuen Pun, Raleigh, NC (US);

Doowon Suh, Cary, NC (US);

Matthew Donofrio, Raleigh, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/46 (2010.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/007 (2013.01); H01L 33/20 (2013.01); H01L 2224/73265 (2013.01);
Abstract

Light emitting diodes include a silicon carbide substrate having first and second opposing faces, a diode region on the first face, anode and cathode contacts on the diode region opposite the silicon carbide substrate and a hybrid reflector on the silicon carbide substrate opposite the diode region. The hybrid reflector includes a transparent layer having an index of refraction that is lower than the silicon carbide substrate, and a reflective layer on the transparent layer, opposite the substrate. A die attach layer may be provided on the hybrid reflector, opposite the silicon carbide substrate. A barrier layer may be provided between the hybrid reflector and the die attach layer.


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