The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Apr. 08, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Atsushi Kanome, Tokyo, JP;

Nobutaka Ukigaya, Yokohama, JP;

Koji Hara, Ichikawa, JP;

Satoshi Yoshizaki, Tachikawa, JP;

Masahiko Kondo, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/266 (2006.01); H01L 27/146 (2006.01); G03F 7/00 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); G03F 7/0035 (2013.01); G03F 7/40 (2013.01); H01L 27/1461 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01);
Abstract

A method for manufacturing a semiconductor device comprising, forming a first photoresist pattern by exposing and then developing a first photoresist film formed on a substrate, irradiating the first photoresist pattern with UV light to cure its surface, forming a second photoresist film so as to cover the substrate and the first photoresist pattern, forming a second photoresist pattern and performing ion implantation in the substrate using the second photoresist pattern. The second photoresist pattern is not subjected to UV irradiation after the second photoresist film has been developed and before the ion implantation is performed, or is irradiated with the UV light, after the second photoresist film has been developed and before the ion implantation is performed, under a reduced condition relative to that for the first photoresist pattern.


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