The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Mar. 25, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/04 (2006.01); H01L 23/34 (2006.01); H01L 29/40 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49575 (2013.01); H01L 23/49537 (2013.01); H01L 23/49568 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/73257 (2013.01);
Abstract
In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle and a protection device disposed over the die paddle. The protection device includes a first heat generating zone disposed in a substrate. The first heat generating zone is disposed at a first side facing the die paddle. A solder layer at the first heat generating zone joins the protection device with the die paddle.