The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Sep. 05, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Kenya Watanabe, Suwa, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/04 (2014.01); H01L 25/16 (2006.01); H01L 23/34 (2006.01); H01L 25/065 (2006.01); H01L 25/11 (2006.01); H01L 23/40 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); B81C 1/00238 (2013.01); H01L 23/34 (2013.01); H01L 23/4012 (2013.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 25/117 (2013.01); B81C 2203/0792 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/1461 (2013.01);
Abstract
An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip.