The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

May. 24, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yoji Urano, Osaka, JP;

Akifumi Nakamura, Osaka, JP;

Hayato Ioka, Osaka, JP;

Ryoji Imai, Osaka, JP;

Jun Goda, Osaka, JP;

Toru Hirano, Osaka, JP;

Masanori Suzuki, Osaka, JP;

Hideaki Hyuga, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); F21K 99/00 (2016.01); F21S 8/02 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); F21K 9/17 (2013.01); F21S 8/02 (2013.01); F21Y 2101/02 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/0091 (2013.01);
Abstract

The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.


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