The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Aug. 25, 2015
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Ga Hyun No, Cheongju-si, KR;
Chan Woo Jeong, Chungju-si, KR;
SK HYNIX INC., Icheon-Si, KR;
Abstract
A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.