The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Aug. 26, 2014
Applicant:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aishi-ken, JP;
Inventors:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 23/3171 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03332 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16054 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16059 (2013.01); H01L 2224/16111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/351 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A manufacturing method of a semiconductor device includes placing a mask having an opening on an external region of a top face of a substrate to locate an end portion of the opening of the mask just above a concave portion formed on the top face of the substrate, the external region being located outside the concave portion. The manufacturing method further includes: growing a conductive film on part of the top face of the substrate through the mask after the mask is placed on the substrate, the part of the top face containing the concave portion; and removing the mask from the substrate after the conductive film is grown.