The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Feb. 03, 2015
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
Andrew Pye, Somerville, CA (US);
Rodrigo Carrillo-Ramirez, Chelmsford, MA (US);
Assignee:
ANALOG DEVICES, INC., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49575 (2013.01); H01L 24/09 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01);
Abstract
An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.
Pye, Andrew. (2016). High frequency integrated circuit and packaging for same (U.S. Patent No. 9437558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9437558
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile