The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Mar. 13, 2013
Applicants:
Norimune Orimoto, Toyota, JP;
Makoto Imai, Toyota, JP;
Inventors:
Norimune Orimoto, Toyota, JP;
Makoto Imai, Toyota, JP;
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29036 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32113 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83129 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member. At least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.