The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Mar. 06, 2013
Applicant:

Panasonic Corporation, Kadoma-shi, Osaka, JP;

Inventors:

Zyunya Tanaka, Osaka, JP;

Masanori Minamio, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/04 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 25/11 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); H01L 21/52 (2013.01); H01L 23/4334 (2013.01); H01L 23/49555 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/09 (2013.01); H01L 25/115 (2013.01); H01L 23/3107 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2021/60015 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80801 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01);
Abstract

In a method for manufacturing a semiconductor device according to the present invention, as shown in FIG.(A), a case () including a first terminal () is placed on a working table () with an opening () formed at the bottom of the case (). Subsequently, as shown in FIG.(B), a plurality of packages () including second terminals () are placed on the working table () through the opening () of the case (), forming a clearance () between the first terminal () and the second terminal (). As shown in FIG.(C), a bonding material () is disposed in the clearance () so as to electrically connect the first terminal () and the second terminal (). Thus, the exposed surfaces of the packages () in the opening () of the case () are aligned at the same height, thereby reducing variations in thermal resistance among the packages ().


Find Patent Forward Citations

Tanaka, Zyunya. (2016). Method for manufacturing semiconductor device and semiconductor device (U.S. Patent No. 9437508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9437508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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