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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9437489 B1

PDFFull Text
Date of Patent:
Sep. 06, 2016

Filed:

Dec. 03, 2013

Method of manufacturing a wiring substrate

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Tsuyoshi Yoda, Matsumoto, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H05K 3/40 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); B81B 7/00 (2006.01); G01C 19/56 (2012.01); G01C 19/5776 (2012.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); B81B 7/0006 (2013.01); G01C 19/56 (2013.01); G01C 19/5776 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H05K 3/225 (2013.01); H05K 3/321 (2013.01); H05K 3/4038 (2013.01); H05K 3/429 (2013.01); H05K 3/462 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0271 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49126 (2015.01); Y10T 29/49128 (2015.01); Y10T 29/49139 (2015.01);
Abstract

A method of manufacturing a wiring substrate including a step of forming a through hole that includes forming a first concave portion in a substrate that extends from a second surface to a first insulating layer without passing through the first insulating layer; forming a second insulating layer at least within the first concave portion; and forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of a pad electrode, wherein the second concave portion is formed within the first concave portion; and filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that it is connected to the pad electrode.

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