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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9437365 B1

PDFFull Text
Date of Patent:
Sep. 06, 2016

Filed:

Jul. 07, 2014

Electronic component and manufacturing method therefor

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Akira Saito, Nagaokakyo, JP;

Makoto Ogawa, Nagaokakyo, JP;

Akihiro Motoki, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

David M Sinclair

Int. Cl.
CPC ...
H01G 4/252 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); H01G 4/12 (2006.01); C25D 3/14 (2006.01); C25D 3/30 (2006.01); C25D 17/16 (2006.01);
U.S. Cl.
CPC ...
H01G 4/252 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); C25D 3/14 (2013.01); C25D 3/30 (2013.01); C25D 17/16 (2013.01); H01G 4/12 (2013.01);
Abstract

An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn—Ni alloy flakes therein, the Sn—Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn—Ni alloy flakes, an observed planar view of a region occupied by the Sn—Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.

Find Patent Forward Citations

Saito, Akira. (2016). Electronic component and manufacturing method therefor (U.S. Patent No. 9437365). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9437365

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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