The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Oct. 09, 2013
Kyoung Hun Shin, Uiwang-si, KR;
DO Hyun Park, Uiwang-si, KR;
Hyun Joo Seo, Uiwang-si, KR;
Young Ju Shin, Uiwang-si, KR;
Kyu Bong Kim, Uiwang-si, KR;
Woo Jun Lim, Uiwang-si, KR;
Kyoung Hun Shin, Uiwang-si, KR;
Do Hyun Park, Uiwang-si, KR;
Hyun Joo Seo, Uiwang-si, KR;
Young Ju Shin, Uiwang-si, KR;
Kyu Bong Kim, Uiwang-si, KR;
Woo Jun Lim, Uiwang-si, KR;
CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;
Abstract
A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.