The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Aug. 04, 2014
Applicant:
Impinj, International Ltd., Seattle, WA (US);
Inventors:
Ronald Lee Koepp, Snoqualmie, WA (US);
Tan Mau Wu, Seattle, WA (US);
Ronald A. Oliver, Seattle, WA (US);
Harley Heinrich, Snohomish, WA (US);
Jaideep Mavoori, Mercer Island, WA (US);
Christopher J. Diorio, Shoreline, WA (US);
Assignee:
IMPINJ, INTERNATIONAL LTD., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); G06K 19/077 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07752 (2013.01); G06K 19/07722 (2013.01); G06K 19/07754 (2013.01); H01Q 23/00 (2013.01);
Abstract
An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.