The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Aug. 25, 2015
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Masayuki Nagano, Kanagawa, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
To provide a high-strength titanium-copper foil that is more suitable as a conductive spring material that can be used in electronic device components such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to a rolling direction, wherein no cracking occurs at bending radius/foil thickness=2 when a W bending test in conformity with JIS H3130: 2012 is performed at a width of 0.5 mm in a direction perpendicular to the rolling direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile