The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Mar. 15, 2013
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

David P. Goelz, Milwaukee, WI (US);

Craig Raleigh, Racine, WI (US);

Don Miletich, Franklin, WI (US);

Kurt S. Wilcox, Libertyville, IL (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 1/00 (2006.01); F21V 29/00 (2015.01); F21V 31/00 (2006.01); F21V 19/00 (2006.01); F21V 29/70 (2015.01); F21W 131/103 (2006.01);
U.S. Cl.
CPC ...
F21V 29/22 (2013.01); F21V 19/0055 (2013.01); F21V 29/2212 (2013.01); F21V 29/70 (2015.01); F21V 31/005 (2013.01); F21W 2131/103 (2013.01);
Abstract

LED lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink. The apparatus may use manipulation involving surface convexity, such as bowing, thereby allowing the securement structure to further facilitate surface-to-surface thermal coupling between the circuit board and the heat sink.


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