The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Apr. 07, 2011
Toshio Morimoto, Yamato, JP;
Tatsuya Takahashi, Yamato, JP;
Isao Ando, Ichikawa, JP;
Tetsufumi Komukai, Ichikawa, JP;
Masanori Takagi, Ichikawa, JP;
Eriko Sato, Ichikawa, JP;
Hirotaka Minami, Ichikawa, JP;
Toshio Morimoto, Yamato, JP;
Tatsuya Takahashi, Yamato, JP;
Isao Ando, Ichikawa, JP;
Tetsufumi Komukai, Ichikawa, JP;
Masanori Takagi, Ichikawa, JP;
Eriko Sato, Ichikawa, JP;
Hirotaka Minami, Ichikawa, JP;
Sumitomo Metal Mining Co., Ltd., Tokyo, JP;
Abstract
Provided are a method for producing a Cu—Ga alloy powder, by which a high quality Cu—Ga alloy powder to be produced readily; a Cu—Ga alloy powder; a method for producing a Cu—Ga alloy sputtering target; and a Cu—Ga alloy sputtering target. Specifically, a Cu—Ga alloy powder is produced by stirring a mixed powder containing a Cu powder and a Ga in a mass ratio of 85:15 to 55:45 at a temperature of 30 to 700° C. in an inert atmosphere thereby accomplishing alloying. Also a Cu—Ga alloy sputtering target is produced by molding the Cu—Ga alloy powder followed by sintering.