The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Jul. 07, 2010
Takeshi Sakurai, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Akira Saito, Aizuwakamatsu, JP;
Yoshihiro Kameyama, Aizuwakamatsu, JP;
Takeshi Sakurai, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Akira Saito, Aizuwakamatsu, JP;
Yoshihiro Kameyama, Aizuwakamatsu, JP;
Mitsubishi Shindoh Co., Ltd., Shinagawa-ku, JP;
Abstract
The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mmto 600 N/mm, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.